Volume 1, No. 2, December, 2013
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Influence of SU8 Photopolymer for Silicon RFMEMS Packaging Applications

Srinivasa Reddy Kuppireddi 1, Sayanu Pamidighantam 2, and Oddvar Søråsen 1
1. Department of Informatics, University Of Oslo, Blindern, Noway
2. P.E.S Institute of Technology, Bangalore, India
Abstract—Epoxy based photopolymer–SU8 is evaluated as microwave packaging material for packaging of Radio Frequency Micro Electro Mechanical Systems (RFMEMS). Standard and Slotted Coplanar Wave guide (CPW) transmission lines are chosen as test vehicles. Transmission lines of lengths up to 10mm are formed on HRS substrates. The fabricated transmission lines are subjected to wafer level packaging. The measured S-parameter data shows a significant difference prior to and after packaging. Further, the effects due to the packaging could be model educing lumped components and the measured data are presented in this work.

Index Terms—RFMEMS, packaging, coplanar waveguides, SU8

Cite: Srinivasa Reddy Kuppireddi, Sayanu Pamidighantam, and Oddvar Søråsen, "Influence of SU8 Photopolymer for Silicon RFMEMS Packaging Applications," International Journal of Materials Science and Engineering, Vol. 1, No. 2, pp. 79-81, December 2013. doi: 10.12720/ijmse.1.2.79-81

General Information

ISSN: 2315-4527 (Print)
Abbreviated Title: Int. J. Mater. Sci. Eng.
Editor-in-Chief: Prof. Emeritus Dato' Dr. Muhammad Yahaya
DOI: 10.17706/ijmse
Abstracting/ Indexing: Ulrich's Periodicals Directory, Google Scholar, Crossref
E-mail: ijmse@iap.org