Volume 10, No. 2, June 2022
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Characterization of Sintered Titanium-Nickel-Diamond Grinding Layers

B. Denkena, A. Krödel, L. Kempf
Leibniz Universität Hannover, Institute of Production Engineering and Machine Tools, Hannover, 30823 Garbsen Germany.

Abstract: This paper explores the influence of the manufacturing parameters and the bond composition of diamond grinding layers on the bond cohesion and strength. A focus is set on the investigation of carbide formation in the interface between bond and diamond grains, which is enabled by active bond materials. The use of active bond materials such as titanium increases the amount of stress the grinding layer can withstand above the point that can be explained solely by the bond strength itself. X-ray diffraction measurements were able to show the formation of titanium carbide in individual cases. The mechanical characterization via three-point bending tests, however, indicated additional effects on the overall cohesion inside the grinding layer, besides the impact of the titanium content alone. Scanning electron microscope micrographs also revealed increased breaking of diamond grains under mechanical load in nickel-titanium bonds compared to bronze bond, which can indicate a stronger adhesion between bond and grain.

Key words: Diamond composites, grinding tools, sintering, characterization.

Cite: B. Denkena, A. Krödel, F. L. Kempf, "Characterization of Sintered Titanium-Nickel-Diamond Grinding Layers," International Journal of Materials Science and Engineering, Vol. 10, No. 2, pp. 18-32, June 2022. doi: 10.17706/ijmse.2022.10.2.18-32
Copyright © 2022 by the authors. This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

General Information

ISSN: 2315-4527 (Print)
Abbreviated Title: Int. J. Mater. Sci. Eng.
Editor-in-Chief: Prof. Emeritus Dato' Dr. Muhammad Yahaya
DOI: 10.17706/ijmse
Abstracting/ Indexing: Ulrich's Periodicals Directory, Google Scholar, Crossref
E-mail: ijmse@iap.org