Abstract: This paper explores the influence of the manufacturing parameters and the bond composition of diamond grinding layers on the bond cohesion and strength. A focus is set on the investigation of carbide formation in the interface between bond and diamond grains, which is enabled by active bond materials. The use of active bond materials such as titanium increases the amount of stress the grinding layer can withstand above the point that can be explained solely by the bond strength itself. X-ray diffraction measurements were able to show the formation of titanium carbide in individual cases. The mechanical characterization via three-point bending tests, however, indicated additional effects on the overall cohesion inside the grinding layer, besides the impact of the titanium content alone. Scanning electron microscope micrographs also revealed increased breaking of diamond grains under mechanical load in nickel-titanium bonds compared to bronze bond, which can indicate a stronger adhesion between bond and grain.

Key words: Diamond composites, grinding tools, sintering, characterization.

Cite: B. Denkena, A. Krödel, F. L. Kempf, "Characterization of Sintered Titanium-Nickel-Diamond Grinding Layers," International Journal of Materials Science and Engineering, Vol. 10, No. 2, pp. 18-32, June 2022. doi: 10.17706/ijmse.2022.10.2.18-32
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